Product
Powder Dicyandiamide
Molecular formula C2H4N4
Molecular weight 84.08
Specification
Superfine Grade
Purity %≥
97.5
Moisture %≤
0.10
Particle size(98%)(µm)
10
Equivalent WT/[H]
21
Recommended use level(phr. EEW=190)
4-15
Heat distortion temperature(°C)
125
Usage 1). One component adhesives. 
2). Epoxy powder coatings. 
3). Prepregs and film adhesives. 
4). Electronic potting and encapsulating compounds.
Appearance Free flowing white powder.

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